MediaTek unveiled its first 6nm chipsets, the Dimensity 1200 and 1100, for high end phones. Next-generation chips for mid-rangers are on the way too, reports DigiTimes, which will slot into the Dimensity 800 and 700 lines.
These will use a more mature node from TSMC, 10nm or 12nm. The focus with these chips will be on power efficiency, sub-6 5G connectivity plus multimedia and gaming performance.
We’ll see how that pans out as even the base Dimensity 700 is fabbed on TSMC’s 7 nm node (N7). MediaTek uses TSMC’s 1 nm node for the likes of the Helio G-series, including the budget offerings like Helio G35 and G25.
Anyway, MediaTek is expected to introduce the new Dimensity 700 chip first, at some point in the April-June quarter. The new Dimensity 800 chip will be shown off at the MWC 2021, which is currently scheduled to take place June 28-July 1 (of course, these dates can change depending on how the situation in Europe develops).
Last year there were rumors of a Dimensity 600 that was slated to come out in Q3. However, it never materialized and nothing has been heard of a 600-series chip since.